SEMICON Taiwan 2017 was held at Taipei World Trade Center from September 13th through 15th.
Shinkawa exhibited and introduced main product as below.
- Wire Bonder (UTC-5000NeoCu)
- Package Bonder (Model: FPB-1sNeoForce)
We appreciate your visit to our booth during the show.
Please feel free to contact us if you have any inquiries regarding our products.
We will strive to further improve our ability and look forward to supporting you.