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What's New

2017/5/12

Shinkawa Announces Results for The Fiscal Year ended March 31, 2017 (PDF 255KB)

2017/5/12

Shinkawa to Release Package Bonder for Multiple Processes: FPB-1ws NeoForce (PDF 144KB)

2017/5/12

Update Summary of selected financial data

2017/4/28

Invitation to 2017 ECTC

2017/3/31

Recruit Site is now available

2017/3/31

Notice of the closing of subsidiary office

2017/3/24

SEMICON China 2017 Report

2017/3/13

Notice of Change of Operating Officers (PDF20KB)

2017/3/10

Consolidated Financial Results for the Fiscal Year Ended March 31, 2017
The Consolidated Financial Results for the Fiscal Year Ended March 31, 2017 will be released at the Tokyo Stock Exchange on May 12, 2017, 15:30 JST.

2017/3/10

Financial Results Presentation Meeting (for securities analysts)
Day and Time: May 15, 2017, 11:00 - 12:00 JST
Location: Kabutocho Heiwa Building 3F (No.3 Seminar Room) in Tokyo, Japan

2017/2/14

Invitation to SEMICON China 2017

2017/2/10

Shinkawa Announces Results for The Nine Months of FYE March 31, 2017 (PDF 118KB)

2017/2/10

Presentation Material of the FY2016 Consolidated Results for the Nine Months of FYE March, 2017 (PDF 563KB)

2017/2/10

Notice of Posting of Non-operating Income, Forecast of Consolidated Financial Results and Forecast Dividend for the Fiscal Year Ending March 31, 2017 (PDF 102KB)

2017/2/1

Shinkawa to Release Wide Area Handling High-speed Wafer Bump Bonder: SBB-5200 (PDF 95KB)

 

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