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UTC-5100NeoCu
Application
Transistors and LEDs
Features
œ Platform that achieved high speed bonding of 42ms/0.7mm (45ms/2mm) with completely updated X, Y and Z motors
œ Bonding accuracy ±3.0μm (at 3σ) achieved
œ Capable of indexing 102mm x 300mm lead frames by allowing Y bonding area of 95mm
œ Simultaneous detection and bonding capability in X and Y directions
UTC-5000NeoCu
Application

CSP, BGA, QFN, Lead frame Type ICs

Features
œ Capable of handling bare Cu wire and Pd coated Cu wire, achieving high speed bonding of 45ms/2mm
œ Bonding accuracy ±2.0μm (at 3σ) achieved
œ Shorter product-type changeover time achieved by digitalizing the flow rate of inert gas
œ Enhanced portability with self-diagnostic function that optimizes servo parameters
UTC-5000
Application

CSP, BGA, QFN, Lead frame Type ICs

Features
œ Platform that achieved high speed bonding of 45ms/2mm with completely updated X, Y and Z motors
œ Bonding accuracy of±2.0μm (at 3σ) achieved
œ Capable of high quality bonding with QFN devices and heavy Cu wire by installing a bonding head with a maximum bond force of 1,000gf and high rigidity transducer
œ Equipped with electric flame-off unit capable of handling wire sizes φ15-50μm without changing unit
œ Capable of indexing 95mm x 300mm lead frames by allowing Y bonding area of 87mm
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