SHINKAWA LTD.
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  • DIE BONDER
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  • FLIP CHIP BONDER
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  • Discontinued Equipment
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FPB-1sNew
Application

Strip type Substrate
Singulated Substrate
Wafer, Panel

 
Features
œ

Chip to Substrate/Wafer (C2S/C2W) face down process (face up process as an option)

œ

Flexibly capable of handling several kinds of processes such as TCB (NCP/NCF/TC-CUF), C2 and C4, and FO-WLP

œ

High-accuracy bonding achieved by adopting the unique Non-vibration System (NVS) technology

œ Capable of bonding various devices such as 2.5D and 3D-stacking with automatic product-type changeover unit
œ Capable of flexible production by short-time changeover from substrate bonding to wafer bonding and vice versa

FPB-1wNew
Application

Wafer, Panel

 
Features
œ

Chip to Wafer (C2W) face down process (face up process as an option)

œ

Flexibly capable of handling several kinds of processes such as TCB (NCP/NCF/TC-CUF), C2 and C4, and FO-WLP

œ

High-accuracy bonding achieved by adopting the unique Non-vibration System (NVS) technology

œ High throughput bonding achieved by rapid heating and cooling with high-speed pulse heater
œ Capable of fast cycle time TCB production by bond stage capable of handling high temperature (200Ž)

FPB-1s
Application

Strip type Substrate
Singulated Substrate
Panel

 
Features
œ

Capable of handling face down process (face up process as an option)

œ

Capable of handling several kinds of processes such as TCB (NCP/NCF/TC-CUF), C2 and C4, and FO-WLP

œ

High-accuracy bonding achieved by adopting the unique Non-vibration System (NVS) technology

œ Capable of handling high force up to 350N with Force Free Gantry (FFG)
œ High throughput TCB bonding achieved by rapid heating and cooling with high-speed pulse heater
œ Capable of bonding various devices such as 2.5D and 3D-stacking with automatic product-type changeover unit
œ Thin die handling capability
Application

Strip type Substrate
Singulated Substrate

 
Features
œ Bonding head which enables high-accuracy height control with wide force range
œ

High-accuracy XY alignment function using low-vibration control technology

œ

High throughput achieved by short heating and cooling with high speed pulse heater

œ

Process monitoring and management function securing stable quality and process portability

œ

Capable of thin die pickup and handling

œ

Capability to handle Flux-TCB process as an option

œ

Downsized equipment (floor space reduced by 15% compared to the previous machine)

Application

φ200mm Wafer
φ300mm Wafer

 
Features
œ Automatic product-type changeover function enables bonding of 4 different product-type chips
œ

High precision control of both bond head force and Z position

œ

High throughput by quick heating and cooling with high speed pulse heater

œ

hin die pickup capability

œ

Traceability to secure stable quality by process monitoring Capability to handle Flux-TCB process as an option

Application

Strip type Substrate
Singulated Substrate on Carrier

 
Features
œ High-speed bonding through parallel processing enabled by a dual flip head and an 8-component synchronized bonding process
œ Outstanding positioning accuracy with a high-rigidity frame and control algorithms
œ Bump recognition camera for high-performance positioning alignment
œ Compact force control heads
œ Compatibility with a wide range of flip-chip sizes from 2mm square to 30mm square
œ Easy-to-configure Dipping station
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