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STC-800
Application

Discrete Devices, Small ICs

Features
œ

Bonding accuracy±20삍i3σj

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10% increase in UPH compared with the conventional models

œ

High-precision lead frame indexing utilizing linear drive

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Capable of handling 86mm width frame, enabling to bond up to 76mm width Y bonding area

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Equipped with a self-diagnostic system, providing long-term stable operation

œ Capable of handling several device conditions by the parameter settings of wafer tape expansion amount and the zoom function for the die recognition camera
UTC5100
Application

Transistors and LEDs

Features
œ This is a platform wire bonder that achieves high-speed bonding of 42ms/0.7mm (45ms/2mm) with developed XY motors and Z motor
œ Bonding accuracy ±3.0μm (at 3σ) achieved
œ Securing a 95mm Y bonding area enables 102mm ~ 300mm lead frame indexing and handling of multi devices for enhancement of productivity
œ Capable of simultaneous detection in X and Y directions
Enlarged range of camera offset in X direction (settable range: 4 - 13mm) from the conventional model
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