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SPA-1000New
Application

Flash Memory Devices,

Features
œ

High-accuracy bonding by unique 3D-NRS technology

œ

High-productivity and space-saving footprint by adopting twin-head

œ

High-speed thin die pick-up system with a speed of 400ms / t:20um(option) *Depending on material conditions

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Friction-free bonding head with simultaneous positional and force control for thin die stacked devices

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Cleanness control with HEPA-filter and stainless steel full cover

œ Equipped with die back-side camera on each bonding head, enhancing inspection function with a total of 8 cameras
œ Capable of handling large substrates up to 120mm width x 300mm length
STC-800
Application

Discrete Devices, Small ICs

Features
œ

Bonding accuracy±20삍i3σj

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10% increase in UPH compared with the conventional models

œ

High-precision lead frame indexing utilizing linear drive

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Capable of handling 86mm width frame, enabling to bond up to 76mm width Y bonding area

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Equipped with a self-diagnostic system, providing long-term stable operation

œ Capable of handling several device conditions by the parameter settings of wafer tape expansion amount and the zoom function for the die recognition camera
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