SHINKAWA LTD.
Products
  • Outline of the business and products
  • DIE BONDER
  • WIRE BONDER
  • FLIP CHIP BONDER
  • BUMP BONDER
  • DISCRETE ASSEMBLERS
  • Discontinued Equipment
  • Disclaimer
  • Site Map
  • Japanese

 
New
Application

RF devices, Crystal devices, MEMS

Features
High-speed bonding of 30 ms/bump based on Wire Bonder model UTC-5000
Capable of handling up to 6-inch wafers by incorporating wafer rotary stage

Equipped with two wafer stages with temperature up/down control function, reducing wafer changeover time and increasing productivity

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