【Supporting the assembly process of semiconductor production】
The semiconductor production process consists of the wafer process to form a circuit on a silicon wafer and the assembly process to split the wafer into IC chips for assembly into a semiconductor product. The Shinkawa precision robot assembles the IC chips into semiconductor products, bonds the chips onto lead frames (die-bonding process), and then uses gold wire to connect the electrodes of the bonded chip and the lead frame (wire-bonding process).
In the past, electrodes were manually connected. In 1977, Shinkawa succeeded in commercializing the first fully automatic wire bonder in the world, which earned the trust of the world's semiconductor manufacturers. Now, the company is one of the world's leading players in the wire bonder market.
【All-Round Manufacturer Who Offers All the Equipment Required for Bonding】
Shinkawa has built a wealth of knowledge and expertise across a wide range of sophisticated hardware and software technologies, always in cutting-edge fields, including robotics, image processing systems and precision control, as exemplified by the world's first automatic wire bonders. We are the total manufacturer in the world who offers all the equipment required for bonding, including die bonders and flip chip bonders as well as wire bonders.
And we consistently deliver customer satisfaction by comprehensively identify bonding equipment needs and applying this knowledge to marketing and research and development.