SHINKAWA LTD.
   

2017/3/31

Recruit Site is now available

 
   

2017/3/31

Notice of the closing of subsidiary office

 
   

2017/3/24

SEMICON China 2017 Report

 
   

2017/3/13

Notice of Change of Operating Officers (PDF 20KB)

 
   

2017/3/10

Consolidated Financial Results for the Fiscal Year Ended March 31, 2017
The Consolidated Financial Results for the Fiscal Year Ended March 31, 2017 will be released at the Tokyo Stock Exchange on May 12, 2017, 15:30 JST.

 
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Shinkawa commands the top global share as a manufacturer of bonders for
the assembly process of semiconductor manufacturing (packaging). In a
dramatically changing semiconductor industry, the company has met the

expectations of the world's semiconductor manufacturers for more than
fifty years as a reliable brand.

A global leader in the manufacture of semiconductor production equipment SHINKAWA LTD.
(C) Copyright SHINKAWA LTD.