SHINKAWA LTD.
   

2017/6/16

The change of subsidiary’s phone and fax number

 
   

2017/6/13

Notice of the 59th Ordinary General Meeting of Shareholders (PDF 217KB)

 
   

2017/6/7

The Consolidated Financial Results for the Three Months of the Fiscal Year Ending March 31, 2018

will be released at the Tokyo Stock Exchange on August 7, 2017, 15:30 JST.

 
   

2017/6/5

Notice of subsidiary office relocation

 
   

2017/5/12

Shinkawa Announces Results for The Fiscal Year ended March 31, 2017 (PDF 921KB)

 
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Shinkawa commands the top global share as a manufacturer of bonders for
the assembly process of semiconductor manufacturing (packaging). In a
dramatically changing semiconductor industry, the company has met the

expectations of the world's semiconductor manufacturers for more than
fifty years as a reliable brand.

A global leader in the manufacture of semiconductor production equipment SHINKAWA LTD.
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